Electronics

Chip On Board Epoxy (COB) The chip-on-board epoxy has excellent thermo-mechanical properties and adhesion strength that provides maximum protection to the components, ICs and bonded wires. Dam and fill epoxy are suitable for encapsulation of bigger components and ICs. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Mixed Viscosity (cP at 25°C)	Shelf Life (month)	Tg (˚C)
EN453	Clear COB good for visual inspection	White paste	2hrs @ 125°C	32,000	6	125
EN458	Clear COB good for visual inspection	White paste	1hr @ 120°C or 30 mins @ 150°C	220,000	12	125
EN485	Good protection for IC and electronic components	Black paste	2hrs @ 120°C or 1hr @ 150°C	52,050	6	140
EN525	Good protection for IC and electronic components	Black paste	1hr @ 120°C or 30mins @ 150°C	30,820	12	152
EN641	Good protection for IC and electronic components	Black paste	1hr @ 100°C or 30mins @ 120°C	30,000	9	112
EN690	Good weatherability	Black paste	1hr @ 100°C	23,850	6	111
EN943-19	Excellent UV and heat resistant Sealant for automotive LED and electronic devices	Black viscous liquid	30mins @ 150°C	4,800	6	NA
PT300	2-Part casting epoxy Ideal for casting of components for failure analysis	Clear + clear yellow liquid	2hrs @ 25°C	1,700	12	80
EN418-2	Encapsulation of IC on PCB Low temperature cure Good adhension to glass, FR4, SS and Ultem Low CTE Low BLT	Black	2hrs @ 85°C or 1hr @ 100°C	23,460	6	NA
EN418-12	Flowable liquid Suitable for gab filling applications	Black	2hrs @ 100°C	9,850	6	NA
EN456	Heat cure adhensive Excellent adhension to PCB Good thermal shock properties Long pot life Sealing of electronics components like relays Encapsulation of IC devices	White	2hrs @ 125°C or 1hr @ 150°C	140,000	6	125
EN475-9	COB epoxy Encapsulation of IC on PCB and smart card IC Sealing of electronic and eletrical devises Good temperature performance Execellent adhension to most PCB and electronic components	Black	2hrs @ 110°C or 1hr @ 120°C	1,800	12	100
EN893-2	Silicone wire encapsulant Cure rapidly over 100°C and has low volatile during curing No sagging Low temperature stable Low outgassing Soft silicon encapsulant to protect gold wire, sensor, especially for heat sensitive electronic component	Slight Translucent	2hrs @ 100°C	4,300	6	-98
EN893-3	Heat curable silocone resin Cure rapidly Low volatile content Shore OO hardness Good adhension to glass High and low temp flexibility	Slight Translucent	2hrs @ 100°C	3,424	6	-108
EN943-24	Silicone encapsulant Semi thixotropic Low impurity ionic content Good adhension to glass, metal, PCB and electronic components sealing Low storage modulus at low temperature Low shore A hardness.	Black	30mins @ 150°C or 2hrs @ 100°C	7,956	6	-102
EN943-25	Silicone encapsulant Semi thixotropic Good adhension to glass, metal, PCB and electronic components sealing Low modulus Low shore A hardness	Black	30mins @ 150°C	1,734	6	NA
EN100-1	2-Part rapid set adhensive based on epoxy Blush free Hard Tough Good scratch and water resistance Enhance adhesion on wet glass, ceramics, most plastics, metal Fast cure Low stress	Clear to sligh yellowish	2hrs @ 25°C	1,700	12	NA

SMT Epoxy / Die Attach The SMT epoxy is designed for high speed dispensing with good green strength to hold components in the bond pads. The viscosity and thixotropy are optimized with no bleeding and tailing. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
CB643	High speed dispensing Fast cure with reflow oven	Red paste	90s @ 150°C or 300s @ 115°C	30,000 *	12	120
CB644	High speed dispensing Fast cure with reflow oven	Black paste	5mins @ 150°C, 20mins @120°C or 30mins @ 100°C	5,500,000 **	6	131
CB648	High speed dispensing Fast cure with reflow oven	Red paste	90s @ 150°C or 2hrs @ 80°C	5,000,000 **	12	135
CB651	High speed dispensing Fast cure with reflow oven	Red paste	5mins @ 150°C, 20mins @ 120°C or 30mins @ 100°C	6,000,000 **	12	124
CB603-2	High speed dispensing Cure fast at low temperature Excellent adhension to PCB and electronic components Has relatively low viscosity for every high speed dispense from automated SMT dispending machine General bonding for many plastics, ceramic and mental	Black paste	40mins @ 80°C	42,250	6	120
CB621	High speed SMT epoxy Cure fast at low temperature Excellent adhension to PCB and electronic components Has long pot life, minimal stringing, prevent sagging. Has relatively low viscosity for every high speed dispense from automated SMT dispending machine	Red paste	90sec @ 150°C or 5min @ 120°C or 15min @ 100°C	17,000	6	NA
CB625-3	High speed SMT epoxy Cure fast at low temperature Excellent adhension to PCB and electronic components Has relatively low viscosity for every high speed dispense from automated SMT dispending machine	Red paste	5min @ 150°C or 2hr @ 80°C	118,533* 4,000,000**	12	101
CB648-2	High speed SMT epoxy Fast cure Good adhension to glass, FR4, SS, AI, PC, plasic, ceramic and metals	Red	90s @150°C or 5min @ 150°C	223,300***	12	101

* Vicosity tested at CAP 2000+ viscometer, 25°C, Cap-06@100rpm
** Vicosity tested at Brookfield RVT, 25°C

Silver Epoxy / Die Attach The silver die attach has been designed for auto dispensing, stamping and screen printing with excellent adhesion on various substrates such as copper and gold. Besides the electrical conductivity, it has excellent thermal conductivity which makes it suitable for bonding components that generate heat. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)
AG803	Good adhesion strength High Tg	Silver paste	2hrs @ 120°C, 1hr @ 150°C or 30mins @ 170°C	25,000	12
AG806	Good adhesion strength High Tg	Silver paste	2hrs @ 120°C or 1hr @ 150°C	65,000	9
AG830-12	Low curing temperature (80-100°C) Low stress	Silver paste	1hr @ 90°C	3,200	3 hours
DA620	Good adhesion Good for transparent die attach Good UV and heat resistance Suitable for stamping and dispensing process	Translucent liquid	2hrs @ 120°C or 1hr @ 150°C	7,500	6
DA669	Fast cure Low stress	Clear liquid	13mins (Gel time) & 2hrs (Cure Time) @ 120°C or 2mins (Gel time) & 1hr (Cure Time) @ 150°C.	1,000	6
DA669-2	Good adhesion Good for transparent die attach Suitable for stamping and dispensing process	Translucent liquid	2hrs @ 120°C or 1hr @ 150°C	7,500	6
DA669-3	Suitable for die attach of high performance microelectronic semiconductor and optoelectronic component Excellent performance in temperature cycling, high temperature storage, humidity storage and light output degradation Outdoor weathering performance Good UV resistance	Translucent liquid	2hrs @ 120°C or 1hr @150°C	5,500	6
DA669-4	Black jetting COB Suitable for die attach of high performance microelectronic semiconductor Recommand for bonding of electronic, plastic, ceramic and metal Excellent performance in temperature cycling, high temperature storage, humidity storage and light output degradation Outdoor weathering performance Good UV resistance	Black	1hr @ 120°C	6,500	6
DA620-1	Die attach epoxy Suitable to most electronic part, plastic, ceramic and metal Good performance in temperature cycling, high temperature storage and humidity storage Good UV resistance	White	2hrs @ 120°C or 1hr @ 150°C	5,800 - 7,800	6
AG824	Ag conductive epoxy Low viscosity Good adhensive Bonding IC chip to metal bond pad and general electrical connection	Silver paste	2hrs @ 150°C	7,000	6
AG824-1	Ag conductive epoxy Cured and hardened at 150°C Good electrical and thermal conductive properties, controlled 30um BLT Low viscosity Good adhensive Good thermal resistance Bonding IC chip to metal bond pad and general electrical connection.	Silver paste	2hrs @ 150°C	12,713	6
AG815-1	2-Part conductive potting epoxy Good scratch and water resistance Enhance adhension on wet glass, ceramic, plastic and metal Good flow, good sea page and min trap of bubbles	Black	2hrs @ 80°C or 24hrs @ 25°C	15,300	12
AG819-3	Flexible Ag ink Low electrical resistance Excellent flexibility and elasticity Excellent adhension to polymer and ceramic substrate, long working life at RT Stable at high temperature, 250(30min) Suitable for screen print, flexible printed circuits, RFID antennas and membrane switches	Silver paste	10mins @ 110°C or 30mins @ 80°C	6,750	12
AG819-4	Flexible Ag ink (PU) Low electrical resistance Execellent flexibility and electricity Execellent adhension to polymer, ceramic and electronic component Long working life at RT Stable at high temperature, 250°C (30min) Suitable for screen print, flexible printed circuits, RFID antennas and membrane switches	Silver paste	10mins @ 110°C or 30mins @ 80°C	7,025	12
AG822	Flexible Ag ink Low electrical resistance Execellent flexibility and electicity Execellent adhension to polymer, ceramic and electronic component Long working life at RT Stable at high temperature, 250°C (30min) Suitable for screen print, flexible printed circuits, RFID antennas and membrane switches	Brown	10mins @ 110°C or 10mins @ 80°C	148,000	12

Underfill Epoxy The underfill epoxy is designed with good flow and capillary properties that can fill the area between the die and the carrier. Once cured, it helps to absorb the stress exerted on the solder bumps. It gives strong adhesion and improves the mechanical integrity to ensure long term reliability. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
UF256	Fast cure Low CTE	Off white	5mins @150°C or 10mins @130°C	800	6	102

Epoxy Sealant The epoxy sealant is ideal for bonding and sealing various types of electronic devices such as relays, transformers and fiber optic components. It can be used to bond different types of substrates such as metal, plastic, glass and composite materials. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
GL172	Fast cure Low stress	Dark blue liquid	24hrs @ 25°C or 30mins @ 70°C	21,040	6	70
GL174	Fast cure Low stress	Black paste	24hrs @ 25°C or 3hrs @ 80°C	3,500	3	60
GL440	Good adhesion strength on wide range of substrates Superior physical and mechanical properties after cured	Clear + yellowish liquid	15mins (Gel time) & 2hrs (Cure Time) @ 80°C or 6mins (Gel time) & 1hr (Cure Time) @ 120°C	1,040	12	65
GL506	Good adhesion strength on wide range of substrates Superior physical and mechanical properties after cured	Clear + yellowish liquid	24hrs @ 25°C or 2hrs @ 80°C	32,700	12	90
GL614-4	Good structural epoxy with no flow Low shrinkage during cure Good adhesion to ultem and PCB Pass 2000 hours damp heat at 85°C/ 85% RH Pass 100 cycles thermal shock at -40°C to 85°C Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak	White paste	12mins (Gel time) & 2hrs (Cure Time) @ 100°C or 2mins (Gel time) & 30mins (Cure Time) @ 150°C	42,000	6	121
GL616	Good structural epoxy with no flow Low shrinkage during cure Good adhesion to ultem and PCB Pass 2000 hours damp heat at 85°C/ 85% RH Pass 100 cycles thermal shock at -40°C to 85°C Pass 500 cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak	White paste	12mins (Gel time) & 2hrs (Cure Time) @ 100°C or 2mins (Gel time) & 30mins (Cure Time) @ 150°C	24,000	12	122
GL902-4	Ideal replacement for gasket	Green	24hrs @ 25°C	7,500	12	NA
GL104-2	2-Part epoxy Good scratch and water resistance Enhance adhension on wets glass, ceramic, plastic and metal Low vicosity to ensure good flow, good sea page to every corner and minimum trapping of bubbles Low stress bonding, potting, encapsulation of electronic components	Slightly yellowish	45mins @ 75°C	5,600	12	46
GL107	Food grade epoxy adhensive Excellent adhension to PC boards, electronic components, ceramic, metal and most plastic in electronic Stable pot life High thixotropic BPA Free FDA approval	White paste	Precure 60mins @ 100°C, followed by post cure 20mins @ 150°C	37,530	6	122
GL158	Electronic epoxy No sagging Stable pot life Excellent adhension to most PC boards and electronic components Low viscosity for faster dispense from syringe High thixotropic	Off white paste	2hrs @ 100°C, or 30mins @ 150°C	35,000	12	156
GL168	Electronic epoxy Cure fast at elevated temperature Excellent adhension to most PC boats and electronic component Design for bonding electronic components, low viscosity for faster dispense from syringe High thixotropic to control the flow	Off white paste	2hrs @ 100°C, 2hrs @ 120°C or 30mins @ 150°C	45,000	12	150
GL614	Electronic epoxy No sagging Has stable pot life For bonding electronic components Low viscosity for faster dispense from syringe High thixotropic to control the flow	White paste	2hrs @ 100°C or 30mins @ 150°C	24,000	12	122
GL614-8	Electronic epoxy Excellent adhension to most PC board and electronic components No sagging Stable pot life High thixotropic Good adhension to PCB, SS, ceramic and metal	Black	Pre-cure 60mins	47,000	6	115
GL901-5	Blue colour Silicon adhensive Excellent low and high temperature performance Adhension to various substrate (metal, ceramic, plastic, Si rubber) can be improved with CT686-4, Silicon primer High shore A hardness Smooth shiny surface	Blue	30mins @ 150°C	15,700	6	NA
GL904-2	2-Part rapid set reactiveeEpoxy Good scratch and water resistance Enhance adhension on wet glass, ceramic, most plastic and metal Low stress epoxy for electrical and electronic devices	Sligh translucent yellowish	24hrs @ 25°C or 1hr @ 80°C	5,082	12	NA
GL311-1	Structural epoxy Good water resistance Enhance adhension Low viscosity For strucural applications, lamination of quality boat	Clear	24hrs @ RT	1,400	12	NA
GL441	Heavy epoxy paste Good water resistance Enhance adhension Specially formulated for potting or encapsulation of electronic devices High viscosity	Beige liquid	24hrs @ RT	24,400	12	NA
GL507	Heavy epoxy paste Good water resistance Enhance adhesion Specially formulated for potting or encapsulation of electronic devices	Beige liquid	24hrs @ RT	200,000	12	NA
GL904-2	2-Part rapid reactive epoxy Good scratch and water resistance Enhance adhension on wet glass, ceramic, plastic and metals	Sligh translucent yellowish	24hrs @ 25°C or 1hrs @ 80°C	5,082	12	NA
GL104-2	2-Part epoxy Good scratch and water resistance Enhance adhension on wet glass, ceramic, plastic, metal. Low viscosity to ensure good flow, good seapage to every coner ans minimum trapping of bubbles Low stress bonding, potting and ensapsulation of electronic components	Slightly yellowish	45mins @ 75°C	5,600	12	46
GL107	Food grade epoxy adhensive Excellent adhension to PC board, electronic components, ceramic, metal and most plastic in electronic Stable pot life High thixotropic BPA free FDA approval	White paste	Precure 60mins @ 100°C, followed by post cure 20mins @ 150°C	37,530	6	122
GL158	Electronic epoxy No sagging Stable pot life Excellent adhension to most PC boards electronic components Low viscosity for faster dispense from syringe High thixotropic	Off white paste	2hrs @ 100°C or 30mins @ 150°C	35,000	12	156
GL168	Electronic epoxy Cure fast at elevated temperature Excellent adhension to most PC boats and electronic component Design for bonding electronic components Low viscosity for faster dispense from syringe High thixotropic to control the flow	Off white paste	2hrs @ 100hrs, 2hrs @ 120°C or 30mins @ 150°C	45,000	12	150
GL614	Electronic epoxy No sagging Stable pot life For bonding electronic component Low viscosity for faster dispense from syringe High thixotropic control flow	White paste	2hrs @ 100°C or 30mins @ 150°C	24,000	12	122
GL614-8	Electronic epoxy Excellent adhesion to most PC board and electronic components No sagging Stable pot life High thixotropic Good adhesion to PCB, SS, ceramic and metal	Black	Pre-cure 60mins	47,000	6	115
GL901-5	Blue color Silicon adhesive Excellent low and high temperature performance Adhesion to various substrate (metal, ceramic, plastic, Si rubber) can be improved with CT686-4, Silicon primer High Shore A hardness Smooth shiny surface	Blue	30mins @ 150°C	15,700	6	NA
GL904-2	2-Part rapid set Reactive Epoxy Good scratch Water resistance Enhance adhesion and wets glass, ceramic, most plastic and metal Low stress epoxy for electrical and electronic devices	Slight translucent yellowish	24hrs @ 25°C or 1hr @ 80°C	5,082	12	NA
GL311-1	Structural epoxy Good water resistance Enhance adhesion Low viscosity Wet the glass fiber network For structural applications and lamination of quality boat	Clear	24hrs @ RT	1,400	12	NA
GL441	Heavy epoxy paste Good water resistance Enhance adhesion Specially formulated for potting or encapsulation of electronic devices High viscosity	Beige white	24hrs @ RT	24,400	12	NA
GL507	Heavy Epoxy Paste Good water resistance Enhance adhesion Specially formulated for potting and encapsulation of electronic devices	Beige white	24hrs @ RT	200,000	12	NA
GL904-2	2-Part rapid reactive epoxy Good scratch Water resistance Enhance adhesion and wet glass, ceramics, plastic and metals	Slight translucent yellowish	24hrs @ 25°C or 1hr @ 80°C	5,082	12	NA

Epoxy Potting / Silicone Potting The potting epoxy and silicone are designed with excellent thermal and mechanical properties that provide maximum protection on the electronic components and devices under critical operation conditions. The viscosity has been optimized with good flow properties for filling up gaps between components. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
PT366	Good Flowability Good weatherability Excellent protection for electronic devices	Black + clear liquid	6hrs (Gel time) & 24hrs (Cure Time) @ 25°C or 30mins (Gel time) & 2hrs (Cure Time) @ 80°C	3,863	12	63
PT369	Good Flowability Optically clear and transparent	Clear liquid	4hrs (Gel time) & 24hrs (Cure Time) @ 25°C or 30mins (Gel time) & 2hrs (Cure Time) @ 80°C or 15mins (Gel time) & 1hr (Cure Time) @ 100°C	17,800	12	71
PT380-1	Good Flowability Good weatherability Excellent protection for electronic devices	White liquid	24hrs @ 25°C or 3hrs @ 80°C	1,720	12	NA
PT497	Good Flowability Optically clear and transparent	Clear liquid	24hrs @ 25°C or 3hrs @ 80°C	860	12	95
PT605	Good Flowability Good weatherability Low stress	Black + yellowish clear liquid	24hrs @ 25°C or 3hrs @ 80°C	32,000	12	NA
PT910-4	Good Flowability Good weatherability High heat resistance	Black liquid	24hrs @ 25°C	7.500	12	NA
PT542	Optoelectronic Epoxy Encapsulation of high performance optoelectronic devices, LED chip and components Bonding of electronic part, plastic and ceramic Excellent performance in temperature cycling, high temperature and humidity storage, minimal light output degradation Outdoor weathering Maximum resistance to yellowing from oxidation, high temperature degradation and sunlight Good crack resistance from thermos-mecanical stress	Blue liquid	Precure 60mins @ 120°C-125°C Post cure: 120mins @ 125°C-135°C	3,200	12	24
PT605	2-Part Flexible black potting epoxy Good scratch and water resistance Enhanced adhesion Low viscosity Suitable for wet glass, ceramic, most plastic and metal	Black	24hrs @ 25°C or 3hrs @ 80°C	1,700	12	NA
PT605-3	2-Part flexible black potting epoxy Good scratch and water resistance Enhance adhesion, low viscosity Suitable for wet glass, ceramic, plastic and metal	Black	24hrs @ 25°C or 4hrs @ 50°C	1,700	12	NA
PT605-6	Flexible translucent potting epoxy Good scratch and water resistance Enhance adhesion Low viscosity Suitable for wet glass, ceramic, most plastic and metal	Transcucent liquid	24hrs @ 25°C, 4hrs @ 50°C or 3hrs @ 80°C	970	6	-28°C
PT605-9	Flexible black potting epoxy Good scratch and water resistance Enhance adhesion to ultem and metal Low viscosity to ensure good flow, good seepage into corners and minimum trapping of bubble For low stress potting/backfill/ encapsulation of electronic component Soft shore A hardness	Black	1.5hrs @ 135°C	970	6	-28°C
PT609-3	2-Part flame retardant encapsulant epoxy Good scratch and water resistance Enhance adhesion on wet glass, ceramic, most plastic and metal Prevent excessive flow during application Epoxy encapsulant or dam material for electrical and electronic devices	White	48hrs @ 25°C or 2hrs @ 80°C	10,464	12	45
PT610	2 part flame retardant potting epoxy Low viscosity Good scratch and water resistance. Enhance adhesion on wet glass, ceramics, plastics and metals Good flow, good seepage to every corner, Room temperature cure Vertical flame rating UL94-V0. Potting/back-fill epoxy for electrical and electronic devices	Black liqud	24hrs @ 25°C or 1hr @ 80°C	286,564	12	54
PT910-10	Silicone potting 2 part addition cure liquid silicon rubber Good optical transparency and low shrinkage Low hardness Provide low stress for excellent performances in temperature cycling, high temperature storage, high humidity storage and outdoor weathering Solventless, no by-product Flexible Used for potting/encapsulation for LED device or other electronic components	Clear Transparent	24hrs @ 25°C or 30mins @ 120°C	4,600	12	NA
PT917-1	2-part addition cure silicone Provide solid flexible silicon rubber with low hardness Good high temperature performance and low thermal mechanical shrinkage Used as moldmaking material For reproduce intricate and high quality replicas	Ligth Blue	24hrs @ 25°C or 2hrs @ 80°C	15,450	12	NA
PT917-2	2 part mold-making silicon Good high temperature performance Low thermal mechanical shrinkage Medium hardness Provide low stress for excellent performance in temperature cycling, high temperature storage, high humidity storage and outdoor weathering Good in mechanical strength Fast cure	Translucent	24hrs @ 25°C or 2hrs @ 80°C	4,200	12	NA
PT917-3	2 part mold-making silicon Good temperature performance Low thermal mechanical shrinkage Medium hardness Low stress for excellent performance in temperature cycling, high temperature storage, high humidity storage and outdoor weathering Good mechanical strength Fast cure	Light blue	24hrs @ 25°C or 2hrs @ 80°C	4,200	12	NA
PT1002	Rigid system for surface mount encapsulation of LED chip in OPTO devices Excellent environmental protection, become lens portion of devices and displays excellent clarity and light transmissivity Available in several transparent/diffused color in addition to standard clear Excellent material for high temperature casting of discretes	Blue Liqud	Pre cure, 2hrs @ 135°C or 8hrs @ 150-160°C	360-8115	18	130

UV Epoxy / Silicone The UV epoxy is suitable to bond fiber optic components, electronic components, LCD panels and other type of substrates such as plastic, Ultem and metals. The UV curable silicone is specially designed for COB process in the manufacturing of LED. It is more economical compare to the conventional molding process. Besides the high UPH, it gives all the excellent properties that required in high power LED. Application: PCBA (Printed Circuit Board Assembly), sealing and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure	Viscosity (cP)	Shelf Life (month)
UV200	Excellent flexibility Good toughness Low cure shrinkage Good adhesion to a variety of substrates	Yellowish transparent liquid	320 - 400 nm, 420mW/cm2 for 10s	245	6
UV255	Coating on flexible substrates	Light grey liquid	20s @ UV 60mW/cm2 or 10mins @ 150°C	3,500	6
UV367	Housing of electronic components for tape and reel	Clear liquid	3s @ UV 1000mW/cm2	740	12
UV379-1	Bonding of plastic parts to PCB/MCPCB	Translucent liquid	5s @ 400mW/cm2 UV Intensity	17,500	6
UV566-14	Excellent thermal-physical stability Bonding for highly sensitive devices such as optical communication devices	White translucent paste	3s @ UV 1000mW/cm2 or 5 seconds at UV 500mW/cm2 or 15s @ UV 200mW/cm2 + 30mins @ 120°C	12,000	6
UV566-25	Medium viscosity Heat cure epoxy system Good toughness Good adhesion to metals, glass Not inhibited by oxygen during UV cure	Translucent white	Pre-cure: 2W/cm2, 15s (365nm) Post cure: 1-1.5hrs @100-130°C	13,760	6
UV788-2	UV curable epoxy system Structural adhesive High flow rate Good adhesion to metal, plastics and glass Not inhibited by oxygen during UV cure. Low CTE Flowable Pass PCT test 48 hr without delamination Pass MSL 85C/85% RH 2000 hr	Translucent white	Precure: 365nm: 15sec, 2000mW/cm2 Postcure: 1hr @100°C or above.	22,800or 51,590*	6
UV767-2	UV-Vis curable acrylate Good toughness Good adhesion to various substrate including glass, metal and plastics Stable at room temperature Pass MSL 85C/85%RH 1000 hr without delamination	Translucent yellowish	(365nm):2000mW/cm2, 3-15s (380-500nm): 500mW/cm2 or above, 10s (320-380nm): 300mW/cm2, 3s (Sunlight): 30s	7,600	12

** Viscosity CP25-1, 10s-1 at 25C

Acrylic Conformal Coat The conformal coat provides excellent moisture and environmental protection. It is a one-component, solvent-based, air-dried coating system. It has a fluorescent agent for easy inspection under UV light. It is recommended for coating and protection of electronic parts, most plastics, ceramics and metals. Application: PCBA (Printed Circuit Board Assembly), sealing, coating and bonding of electronic components and devices.
Product Code	Special Features	Appearance	Cure	Viscosity (cP)	Shelf Life (month)	Fluorescent Agent
CT682	Fast drying Good adhesion	Clear liquid	16hrs @ 25°C or 30mins @ 80°C	320	12	Yes
CT684	Fast drying Good adhension	Clear liquid	16hrs @ 25°C or 30mins @ 80°C	320	12	No
CT986-4	Solvent based silicone primer Used as surface treating agent for bonding potting cured silicone rubber with plastic material such as PC, nylon and metal substrate Blue color indicator for inspection	Blue Liquid (Silanes)	10-30mins dry RT	<30	6	Blue color
CT682-1	Solvant based acrylic conformal coating Air dried coating system Coating and protection of electronic components, PCBA, most plastics, ceramic and metals Excellent moisture and environmental protection Water resistance Easy inspection under UV light	Clear liquid	16hrs @ 25C or 30mins @ 80C	65	12	Yes
CT682-2	Solvent based flame retardant conformal coating Air-dried coating system Excellent moisture and environmental protection Coating and protection of electronic parts, most plastic, ceramic and metal	Translucent liquid	16hrs @ 25°C or 30mins @ 80°C	385	12	Yes
CT985-5	Heat cure silicone conformal coating Good self-levelling Long pot life. Provide very good high temperature performance Good flexibility Low thermal mechanical shrinkage Low moisture absorption an be used for conformal coating for PCB, sensor and junction coating for semiconductor	Translucent liquid	5mins @ 130°C, 60mins @ 150°C (less surface tackiness)	2,980	6	No