Optoelectronic

 

Casting Epoxy
The 2-part casting epoxy is suitable for through hole LED (3/5mm, Oval & Flat-top), Super Flux and Snap LED. It has outstanding performance for outdoor applications such as automobile lightings, signals & indicators and traffic signal lights.

Application:
Automotive lighting & signal lamps, indicators for electronics devices, signboards, banners and traffic lights.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Mixed Viscosity
(cP at 25°C)
Shelf Life
(month)
Tg (˚C)

PT1002
  • Meet specifications for rear combination lamps for automotive
 Blue liquid Pre cure 2hrs @ 135°C
Post cure 8hrs @ 
150-160°C		 588 18 130

PT542
  • Meet specifications for rear combination lamps for automotive
 Blue liquid Pre cure 1hr @ 125°C
Post cure 2hrs @ 135°C		 550 12 145

OP695-7
  • Meet specifications for rear combination lamps for automotive
 Blue liquid Pre cure 1hr @ 125°C
Post cure 2hrs @ 135°C		 800 12 141

OP692-6
  • Excellent UV resistance
  • Indoor and outdoor LED lighting
 Blue + yellow liquid Pre cure 2hrs @ 120°C
Post cure 2hrs @ 150°C		 550 12 135
 
 

High Brightness LED Epoxy & Silicone
The high brightness silicone has the advantage of low thermo-mechanical stress and high thermal & radiation resistance. It has a wide range of refractive index ranging from 1.41 to 1.55. It is suitable for COB type in-door and out-door commercial and architectural lighting.

Application:
Commercial lighting, Architectural lighting, Indoor/Outdoor lighting & signboard.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life
(month)
 
Refractive index
(RI)

OP954-10
  • Compression molding for CSP (Chip Scale Package)
 Transparent liquid Pre cure 5mins @ 120°C
Post cure 3hrs @ 150°C		 11,000 12 1.53

OP959-7
  • Encapsulation of PLCC/SMD packages
  • Lower hardness (Shore A 62)
 Transparent liquid 3hrs @ 170°C - 12 1.54

OP959-8
  • Encapsulation of PLCC/SMD packages
  • Higher hardness (Shore A 78)
 Transparent liquid Pre cure 1hr @ 40°C
Post cure 1hr @ 120°C and 2hrs @ 150°C		 4,613 12 1.54

OP966
  • Suitable for compress molding
 Transparent liquid Pre cure 1 min @ 150°C
Post cure 2hrs @ 150°C		 8,300 12 1.41

OP955-4
  • Suitable for COB encapsulation
 Transparent liquid 2hrs @ 160°C 3,000 12 1.41
 
 

SMD/PLCC Epoxy & Silicone
The SMD/PLCC epoxy and silicone are designed with good heat and UV resistance that meets MSL2 requirements. It can be used as backlighting in LCD panel for TV, hand phone and tablets. It is also commonly used in architectural and automotive lighting.

Application:
Backlighting for display panels (LED TV, mobile phone and tablets), Architectural lighting, Outdoor display panel and General lighting.
Product Code
Special Features
Appearance
Cure (˚C/ Time)
Viscosity (cP)
Shelf Life (month)

OP685-5
  • Low stress
  • Excellent UV resistance
  • Good heat resistance
  • Good for PLCC/SMD devices
 Clear liquid Pre cure 2hrs @ 120°C
Post cure 2hrs @ 150°C		 825 12

OP685-10
  • Excellent UV resistance
  • Indoor and outdoor LED lighting
 Clear blue liquid Pre cure 2hrs @ 120°C
Post cure 2hrs @ 150°C		 820 12

OP685-16
  • Low stress
  • Excellent UV resistance
  • Excellent heat resistance
  • Good for PLCC/SMD devices
 Clear liquid Pre cure 2hrs @ 120°C
Post cure 2hrs @ 150°C		 2,250 12

OP955-4
  • Suitable for COB encapsulation
 Transparent liquid 2hrs @ 160°C 3,000 12

OP959-7
  • Encapsulation of PLCC/SMD packages
  • Lower hardness (Shore A 62)
 Transparent liquid 3hrs @ 170°C 4,375 12

OP959-8
  • Encapsulation of PLCC/SMD packages
  • Higher hardness (Shore A 78)
 Transparent liquid Pre cure 1hr @ 40°C
Post cure 1hr @ 120°C and
2hrs @ 150°C		 4,613 12
 
 

Potting Epoxy
The potting epoxy has low thermo-mechanical stress that makes it suitable for large display module like the S4 (7-segment display) for counters and digital instruments.

Application:
S4 (seven Segment Display) for counters and digital instruments.
Product Code Special Features Appearance Cure (˚C/ Time) Viscosity (cP) Shelf Life
(month)		 Tg (˚C)

OP281-1
  • Low stress
 Blue + clear liquid Pre cure 1hr @ 115°C
Post cure 2hrs @ 125°C		 1,450 12 140
 
 

Silicone Moulding Compound
Silicone base moulding compound is design for high power LED package encapsulation. It has superior reflectivity, high heat and UV resistance, good mechanical strength.

Application:
Can be used on high power LED with over moulding or compress moulding.