Optical Communication

Heat Curable Epoxy Advanced design of epoxies with good bonding strength and optical matching to allow optimum signal transition is always desired in this industry. The heat curable epoxies for precision alignment and optical components that have adhesion on glass, metal, ceramic and most plastic substrates provide excellent thermal and moisture resistance. Application: Sealing fibers into ferrules, bonding optical fibers into connectors or/and ferrules, potting fiber bundles, V-groove array, chip bonding such as fiber media converters and transceiver modules assemblies.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
GL616	Good structural epoxy with no flow Low shrinkage during cure Good adhesion to ultem and PCB Pass 2000 hours damp heat at 85°C/ 85% RH Pass 100cycles thermal shock at -40°C to 85°C Pass 500cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak	White	2hrs @ 100°C or 30mins @ 150°C	24,000	12	122
GL168	Good structural epoxy with no flow Low shrinkage during cure Good adhesion to ultem and PCB Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 48hrs Bond well with metals, ceramics, glass and PCB	White	2hrs @ 100°C or 30mins @ 150°C	45,000	12	119
GL158	Good structural epoxy with no flow Low shrinkage during cure Good adhesion to ultem and PCB. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 48hrs Bond well with metals, ceramics, glass and PCB	White	2hrs @ 100°C or 30mins @ 150°C	35,000	12	119
EN418-2	Good structural epoxy with no flow Low shrinkage during cure Low CTE Good adhesion to ultem and PCB. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 48hrs Bond well on gold, nickel, kovar, stainless steel, aluminium PCB, glass and etc	Black	1hr @ 85°C -120°C	21,000	6	136
EN418-TI	EN418-2 high Thixotropic version Good structural epoxy with no flow Low shrinkage during cure Low CTE Good adhesion to ultem and PCB. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 48hrs Bond well on gold, nickel, kovar, stainless steel, aluminium PCB, glass and etc	Black	1hr @ 85°C -120°C	83,565	6	130
TH737-1	Good structural epoxy with no flow Low shrinkage during cure Good adhesion to Ultem, Aluminium and PCB Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Thermally conductive at 2.6W/mk Bond well on Gold, Nickel, Kovar, Stainless Steel, Aluminium PCB, Glass and etc. Low CTE Pass PCT 121°C, 100%RH, 2 atm, 48hrs	White	30mins @ 95°C	154,870	6	132

UV Curable Adhesive Fast cure, high viscosity UV-curable epoxy system. Excellent flexibility, good toughness and good adhesion to a variety of substrates including metals and plastics. It has low odor and low skin and eye irritation potential. It does not contain volatiles and is very suitable for fiber optic applications. It is not inhibited by oxygen during UV cure, has low shrinkage, high gloss and good resistance to yellowing. The thixotropy has been adjusted to control excessive overflow. Application: Sealing OSA hole, fiber ferrules, bonding optical components, connectors or/and ferrules, potting fiber bundles, V-groove array, chip bonding such as fiber media converters and transceiver modules assemblies.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
UV252	Flowable UV light curable Good optical transmittance from 1000nm and above Good adhesion up to 150kgf/cm Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 48hrs Suitable for epoxy lens, EMC, ceramic, glass, PC, gold, ultem, nickel, stainless steel and PCB	Translucent light yellow	2000mW/cm3, 15s or 350mW/cm3, 100s	9,710	6	114
UV252-1	Slight Flowable UV light curable Room temperature storage Good optical transmittance from 1000nm and above Good adhesion up to 200kgf/cm2 Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 48hrs Suitable for epoxy lens, EMC, ceramic, glass, PC, gold, ultem, nickel, stainless steel and PCB	Translucent light yellow	365nm 2000mW/cm3, 15s or 500mW/cm3, 3s 380-500nm 500mW/ cm3, 20-100s	5,500	5	115
UV252-2	Not Flowable UV light curable Low CTE Good optical transmittance from 1000nm and above Good adhesion up to 200kgf/cm2 Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 24hrs Suitable for epoxy lens, EMC, ceramic, glass, PC, gold, ultem, nickel, stainless steel and PCB	Translucent White	2000mW/cm3, 5s or 300mW/cm3, 100s	26,000	6	106
UV772-5(R2)	Flowable UV and visible light curable Flexible Good adhesion, up to 80kgf/cm2 Good optical transmittance from 1000nm and above Good adhesion, up to 200kgf Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 24hrs	Clear Transparent	365nm-500nm 2000mW, 10s	500	6	30
UV768-9	Flowable UV light curable Good optical transmittance from 900nm and above Good adhesion, 8kgf/cm2 Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 24hrs Suitable for ceramic, glass, ultem, nickel, stainless steel and PCB	Clear Transparent	365nm 2000mW, 15s	2,000	6	108
UV257-3	Flowable UV light curable Flexible Suitable to use for bonding and active alignment for opaque substrates For Pressure sensitive application and adhesive open time is 5mins Good adhesion, up to 300kgf/cm2 Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent	365nm 1600mW, 3.5s	14,063	6	60
UV257-2	Flowable UV light curable Flexible Suitable to use for bonding and active alignment for opaque substrates For pressure sensitive applications and adhesive open time is 1-5mins. Good adhesion up to 300kgf/cm2 Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB. Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent	365nm 2000mW, 7s Or 400mW, 3s *Accelerate room temperature or heat can increase the adhesion is an optional.	10,800	6	72

Dual Cure UV Adhensive Precision alignment UV-curable epoxy system. Excellent range of viscosity selection, toughness and good adhesion to a variety of substrates including metals, PCB and plastics. It has low odour, low outgassing and excellent reliability resistance. It has low outgassing and is very suitable for optic communication applications. It is not inhibited by oxygen during UV cure, has low shrinkage, high gloss and good resistance to yellowing. The thixotropy has been adjusted to control excessive overflow. Application: Sealing fibers into ferrules, bonding optical fibers into connectors or/and ferrules, potting fiber bundles, V-groove array, chip bonding such as fiber media converters and transceiver modules assemblies RI Matching and active alignment applications.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)	Tg (˚C)
UV566-17	Non flowable and high thixotropic index Suitable to use for bonding and active alignment applications Good adhesion, up to 220kgf/cm2 Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent liquid	1000mW/cm2, 3s or 500mW/cm2, 6s or 200mW/cm2, 15s + 120°C/30-120mins	6,000	6	105
UV566-20	Non flowable and high thixotropic Index Suitable to use for bonding and active alignment applications Good adhesion up to 200kgf Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent liquid	320nm -380nm 1000mW/cm2, 3s or 500mW/cm2, 6s or 200mW/cm2, 15s 365nm 2000mW/cm2, 15-25s + 120-130°C, 30mins	6,500	6	<100
UV566-22	Non flowable Suitable to use for bonding and active alignment applications Good adhesion, up to 220kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent Liquid	320nm -380nm 1000mW/cm2, 3s or 500mW/cm2, 6s or 200mW/cm2, 15s 365nm 2000mW/cm2, 15s + 120-130°C, 30mins	4,400	6	<100
UV739-1	Non flowable Thermally conductive UV adhesive High Tg, Low CTE and thermal resistance UV adhesive BLT <50um Suitable to use for die attach, bonding and active alignment applications Good adhesion, up to 280kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Off White	365nm 2000mW/cm2, 30s 500mW/cm2, 60s + 125°C, 60mins	70,500	6	105
UV254	Low viscosity and flowable Shadow Curable adhesive with opaque substrates High Tg and thermal resistance Suitable to use for die attach, bonding and active alignment applications Good adhesion up to 420kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel, ultem and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent White	365nm 2000mW/cm2, 15s + 100°C, 60mins or Heat Cure only 100-130°C/2hrs or above	481	6	165
UV254-1	Slight Flow <1mm Shadow Curable adhesive with opaque substrates Suitable to use for die attach, bonding and active alignment applications Low CTE Can resist 260C reflow for 30mins Good adhesion, up to 480kgf/cm2 After Heat aging at 150C, 11days adhesion 559kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel, ultem and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent White	365nm 2000mW/cm2, 15s or + 80°C, 120mins or 120°C, 60mins	7,913	6	111
UV254-2	Slight Flowable, 40mm Shadow Curable adhesive with opaque substrates Suitable to use for die attach, bonding and active alignment applications Low CTE Good adhesion, up to 460kgf/cm2 After Heat aging at 150C, 11days adhesion 559kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel, ultem and PCB Pass PCT 120°C, 48hrs	Translucent White	365nm 2000mW/cm2, 15s or 320-380nm 2000mW/cm2, 5s + 80°C, 120mins or 120°C, 60mins or For Heat Cure only 80°C-130C, 120mins or above	14,620	6	96
UV777-11	Non flowable adhesive UV LED 365nm and visible light 380-500nm curable High Tg >150C Low CTE Suitable to use for sealing, bonding and active alignment applications Good adhesion up to 80kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, Aluminium, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Yellowish Paste	365nm 2000mW/cm2, 5s or 380-500nm >500mW/cm2,5s + 110-120°C, 60mins	111,000	7	152
UV777-12	Slight flowable, 4mm UV LED 365nm and visible light 380-500nm curable Shadow Curable adhesive with opaque substrates Suitable to use for die attach, bonding and active alignment applications Low Modulus version than UV777-11 High Tg Good adhesion, up to 100kgf/cm2 Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, kovar, aluminium, PC, glass, ultem, stainless steel, ultem and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Yellowish Paste	365nm 2000mW/cm2, 5s Or 380-500nm >500mW/cm2,5s + 110-120°C, 60mins	32,750	5	154
UV788-2	Flowable <30mm Low thermally conductivity <1W/mk Suitable to use for bonding and active alignment including PLC, WMD and optical component applications Low CTE High Tg Comply with NASA Outgassing requirement Low Vapor Transmission rate at MSL85°C/85RH/24hrs Good Relative permittivity from 30MHz to 1GHz Good adhesion, up to 180kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for glass and stainless-steel substrate bonding Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent White	365nm 500-2000mW/cm2, 5s + 100-110°C, 60mins	22,800	6	140
UV788-HV	Hardly flow High viscosity version of UV788-2 Low thermally conductivity <1W/mk Suitable to use for bonding and active alignment including PLC, WMD and optical component applications Low CTE High Tg Comply with NASA Outgassing requirement Low vapor transmission rate at MSL85°C/85RH/24hrs Good Relative permittivity from 30MHz to 1GHz Good adhesion up to 150kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, aluminium, PC, glass, ultem, stainless steel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent White	365nm 500-2000mW/cm2, 5s + 100-110°C, 60mins	66,375	6	120
UV788-HT	Slight flowable 45mm High Tg version of UV788-2 Low thermally conductivity <1W/mk Suitable to use for bonding and active alignment including PLC, WMD and optical component applications Low CTE Extremely high Tg >200C Low linear shrinkage Comply with NASA Outgassing requirement Low Vapor Transmission rate at MSL85°C/85RH/24hrs Good relative permittivity from 30MHz to 1GHz Good adhesion up to 150kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs Able to resist reflow at 260C for 30mins	Translucent White	365nm 500-2000mW/cm2, 15s + 100-110°C, 60mins	28,870	6	203
UV788-2KN	Flowable, 45mm Strongest adhesion to kovar, nickel and gold version of UV788-2 Low thermally conductivity <1W/mk Suitable to use for bonding and active alignment including PLC, WMD and optical component applications Low CTE High Tg >200C Low linear shrinkage Comply with NASA Outgassing requirement Low Vapor Transmission rate at MSL85°C/85RH/24hrs Good Relative permittivity from 30MHz to 1GHz Good adhesion, up to 190kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs	Translucent White	365nm 500-2000mW/cm2, 15s + 100-110°C, 60mins	19,200	6	134
UV788-2SB	Non fllowable version of UV788-2 Low thermally conductivity <1W/mk Suitable to use for structural bonding and active alignment including PLC, WMD and optical component applications Low CTE High Tg >200C Low linear shrinkage Comply with NASA Outgassing requirement Low Vapor Transmission rate at MSL85°C/85RH/24hrs Good Relative permittivity from 30MHz to 1GHz Good adhesion, up to 190kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB. Pass PCT 121°C, 100%RH, 2 atm, 48hrs Able to resist 260C for 30mins	Translucent White		28,340	6	136
UV788-2MR	Flowable, 49mm Strongest moisture resistance version of UV788-2 Low thermally conductivity <1W/mk Suitable to use for bonding and active alignment including PLC, WMD, optical component applications Low CTE High Tg >200C Low linear shrinkage Comply with NASA Outgassing requirement Low Vapor Transmission rate at MSL85°C/85RH/24hrs Good Relative permittivity from 30MHz to 1GHz Good adhesion, up to 240kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, aluminium, PC, glass, ultem, stainless steel, gold, nickel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs Able to resist 260C for 30mins	Translucent White	365nm 500-2000mW/cm2, 15s + 100-110°C, 60mins	17,138	6	150
UV777-9	Flowable for RI matching Low thermally conductivity <1W/mk Suitable to use for bonding optical glass component Low CTE High Tg >200C Low linear shrinkage Comply with NASA Outgassing requirement Low Vapor Transmission rate at MSL85°C/85RH/24hrs Good Relative permittivity from 30MHz to 1GHz Good adhesion, up to 400kgf/cm2 Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, Kovar, aluminium, alumina, PC, glass, ultem, nylon, stainless steel, gold, nickel and PCB Pass PCT 121°C, 100%RH, 2 atm, 48hrs Able to resist 260C for 30mins	Translucent White	365nm 2000mW/cm2, 15s + 100-110°C, 60mins	300,000	6	52
UV782-1	Clear and Transparent Flowable High RI Optical transmittance from 450-1100nm >80% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 110kg/cm2 and 153kgf/cm2 with CT515-1 primer Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, alumina, nickel, kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB Pass PCT 121°C, 100%RH, 2atm, 48hrs Able to resist 260C for 30mins UV+ Heat Curable, high Tg, good reliability, low outgassing, dissipating heat and low outgassing. Suitable for chip bonding. Can cure under UV shadow condition	1.603	2000mW/cm2, 3-15s	860	6	107
UV775-4	Clear and transparent Slight flowable high viscosity Mid RI CTE 50rpm Optical transmittance from 450-600nm >86% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 120kg/cm2. Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, alumina, nickel, kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB Pass PCT 121°C, 100%RH, 2atm, 48hrs Able to resist 260C for 30mins Good resistance to 150C for 72hrs and UV aging	1.529	320nm -380nm, 100mW, 60s + 120-150°C, 60mins	10,875	6	143
UV254	Clear and transparent Flowable Curable with UV or/and heat High Tg Mid RI Optical transmittance from 450-940nm >84% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 423kg/cm2. Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for Ceramic, Alumina, Nickel, Kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB Pass PCT 121°C, 100%RH, 2atm, 48hrs Able to resist 260C for 30mins Good resistance to 150C for 72hrs	1.51	365nm, 2W/cm2,15s + 100-130°C, 60mins	481	6	165
UV773-11	Clear and transparent Flowable High RI CTE 50rpm Optical transmittance from 450-600nm >86% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 304kg/cm2. Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for Ceramic, Alumina, Nickel, Kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB Pass PCT 121°C, 100%RH, 2atm, 48hrs Able to resist 260C for 30mins Good resistance to 150C for 72hrs	1.506	365nm, 2W/cm2,15s + 100-130°C, 60mins	430	6	168
UV773-9	Clear and transparent Flowable High RI Moderate CTE Optical transmittance from 450-600nm >86% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 242kg/cm2. Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for Ceramic, Alumina, Nickel, Kovar, aluminium, glass, ultem, nylon, stainless steel, gold and PCB Pass PCT 121°C, 100%RH, 2atm, 48hrs Able to resist 260C for 30mins	1.494	365nm, 2W/cm2,15s + 100-130°C, 60-160mins	2,600	6	103
UV784-14	Clear and transparent Flowable High flexibility Low Modulus Mid RI Optical transmittance from 450-1000nm >80% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 201kg/cm2. Pass 3000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for ceramic, alumina, nickel, kovar, aluminium, glass, Ultem, nylon, stainless steel, gold and PCB Pass PCT 121°C, 100%RH, 2atm, 168hrs	1.493	365nm, 2W/cm2,15s or 180mW/cm2, 60s + 100-120°C, 60mins	3,600	6	34
UV781-3	Clear and transparent Flowable Low RI Low modulus Optical transmittance from 450-1600nm >86% Suitable to use for RI matching and bonding of optical light path components Good adhesion, up to 62kg/cm2. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for glass, stainless steel, Nickel and PCB. Pass PCT 121°C, 100%RH, 2atm, 24hrs Able to resist 260C for 45mins	1.413	365nm, 2W/cm2,15s + 150°C, 120-200mins	4,076	6	57
OP993-11	Silicone soft gel Clear translucent Flowable Low RI Ultra-low outgassing High Flexibility Optical transmittance at 1100nm >98% Suitable to use for RI matching, bonding of optical light path components and gap filling. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for glass, stainless steel, nickel and PCB. Able to resist 260C for 45mins Able to resist operation up to 300°C and -60C	1.429	100°C, 120mins or 150°C,30mins	3,942	6	-97
EN893-2	Silicone soft gel Clear translucent Slight flowable Low RI Ultra-low outgassing High flexibility Optical transmittance at 850nm >98% Suitable to use for RI matching, bonding of optical light path components, gap filling and small component encapsulation to wire protection Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for glass, stainless steel, nickel and PCB Able to resist 260C for 45mins Able to resist operation up to 300°C and -60C	1.429	100°C, 120mins or 150°C,30mins	4,300	6	-98
OP993-3	Silicone soft gel Clear translucent Able to retain shape after dispense Low RI Low outgassing High flexibility Optical transmittance from 450-1600nm >90% Suitable to use for RI matching, bonding of optical light path components and small component encapsulation. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for glass, stainless steel, nickel and PCB Able to resist 260C for 45mins Able to resist operation up to 300°C and -60C	1.430	100°C, 120mins or 150°C,30mins	6,500	6	-117
OP993-13	Silicone soft gel Clear translucent Slight flowable Low RI Ultra-low outgassing High flexibility Optical transmittance at 1100nm >98% Suitable to use for RI matching, bonding of optical light path components, gap filling, small component encapsulation to wire protection. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak Suitable for glass, stainless steel, nickel and PCB Able to resist 260C for 45mins Able to resist operation up to 300°C and -60C	1.433	100°C, 120mins or 150°C,30mins	15,460	6	-95

EMI Shielding and Silver Epoxy.
Product Code	Special Features	Appearance	Cure (˚C/ Time)	Viscosity (cP)	Shelf Life (month)
EM120-1	Silicone system Good EMI shielding performance up to 80dbm at 200MHz to 39GHz per MIL-DTL-83528C standard. Good compressible gasket Low volume resistivity Suitable to use for EMI shielding onto metal substrates for base stations, PDAs, PC Cards, radios, mobile phones, cast plastic enclosures, packaged electronic assemblies and optical modules up to 800GHz package Good gasketing strength on nickel plated case Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak	Silver Paste	150°C, 120mins	5.5x106	12
EM120-3	Silicone system Good EMI shielding performance up to 100dbm at 200MHz to 39GHz per MIL-DTL-83528C standard Extremely long pot life Good compressible gasket Low volume resistivity Suitable to use for EMI shielding onto metal substrates for base stations, PDAs, PC Cards, radios, mobile phones, cast plastic enclosures, packaged electronic assemblies and optical modules up to 800GHz package Good gasketing strength on nickel plated case. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak	Silver Paste	120-150°C, 120mins	1.3x106	12
EM120-4	Silicone system Good EMI shielding performance up to 100dbm at 200MHz to 39GHz per MIL-DTL-83528C standard. Extremely long pot life Good compressible gasket Low volume resistivity Suitable to use for EMI shielding onto metal substrates for base stations, PDAs, PC Cards, radios, mobile phones, cast plastic enclosures, packaged electronic assemblies and optical modules up to 800GHz package Good gasketing strength on nickel plated case Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C, 20°C/min ramp, 10mins soak	Silver Paste	120-150°C, 120mins	1.25x106	12
AG824	Silver epoxy paste Low viscosity conductive epoxy Low volume resistivity High thixotropic index BLT <30um Easily dispensable for high-speed dispensing High Tg >150°C Bond well on Gold, Nickel, Kovar, Stainless Steel, Aluminium PCB, Silicon, Glass and etc. Suitable for chip bonding, die attach and conductive component bonding. High adhesion strength up to 293kgf/cm2 Low shrinkage during cure Good adhesion to ultem and PCB. Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 24hrs	Silver Paste	150°C, 2hrs	7,000	6
AG824-1	Silver epoxy paste Low viscosity conductive epoxy Low volume resistivity High thixotropic index BLT >30um Easily dispensable for high-speed dispensing High Tg >150°C Bond well on Gold, Nickel, Kovar, Stainless Steel, Aluminium PCB, Silicon, Glass and etc Suitable for chip bonding, die attach and conductive component bonding High adhesion strength up to 293kgf/cm2 Low shrinkage during cure Good adhesion to ultem and PCB Pass 2000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 24hrs	Silver Paste	150°C, 2hrs	12,700	6
AG815-1	2-part nano filler conductive epoxy. Long pot life Solvent-free and low volatiles during cure Low shrinkage during cure Rigid yet flexible Specially developed for low stress to consumer electrical and electronic component bonding to potting Good adhesion various metals and plastics Pass 1000 hours damp heat at 85°C/ 85% RH Pass 1000cycles thermal shock at -40°C to 85°C Pass 1000cycles thermal cycling at 85°C 20°C/min ramp, 10mins soak Pass PCT 121°C, 100%RH, 2 atm, 24hrs	Black Fill	25°C, 24hrs or 80°C, 2hrs	840	12